關(guān)鍵詞:LOCTITE ECCOBOND FP4531(known as HYSOL FP4531)底部填充專為間隙為1mil的柔性倒裝芯片應(yīng)用而設(shè)計。
描述:LOCTITE ECCOBOND FP4531(known as HYSOL FP4531)底部填充專為間隙為1mil的柔性倒裝芯片應(yīng)用而設(shè)計。
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樂泰 LOCTITE ECCOBOND FP4531(known as HYSOL FP4531)底部填充專為間隙為1mil(25.4μm)的柔性倒裝芯片應(yīng)用而設(shè)計。
可快速固化
快速流動
通過美國宇航局低揮發(fā)要求,NASA outgassing
技術(shù)信息 | |
彎曲模量 | 7600 N/mm2 (1102000 psi ) |